Electroless copper-phosphorus coatings with the addition of silicon carbide (SiC) particles

Soheila Faraji, and Afidah Abdul Rahim, and Norita Mohamed, and Coswald Stephen Sipaut @ Mohd Nasri, (2011) Electroless copper-phosphorus coatings with the addition of silicon carbide (SiC) particles. International Journal of Minerals, Metallurgy and Materials, 18 (5). pp. 615-622. ISSN 1674-4799

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Official URL: http://dx.doi.org/10.1007/s12613-011-0486-x

Abstract

Cu-P-silicon carbide (SiC) composite coatings were deposited by means of electroless plating. The effects of pH values, temperature, and different concentrations of sodium hypophosphite (NaH ₂PO ₂ H ₂O), nickel sulfate (NiSO ₄·₆H ₂O), sodium citrate (C ₆H ₅Na 3O ₇· 2H ₂O) and SiC on the deposition rate and coating compositions were evaluated, and the bath formulation for Cu-P-SiC composite coatings was optimised. The coating compositions were determined using energy-dispersive X-ray analysis (EDX). The corresponding optimal operating parameters for depositing Cu-P-SiC are as follows: pH 9; temperature, 90°C; NaH ₂PO ₂·H ₂O concentration, 125 g/L; NiSO 4·₆H ₂O concentration, 3.125 g/L; SiC concentration, 5 g/L; and C ₆H ₅Na 3O ₇·2H ₂O concentration, 50 g/L. The surface morphology of the coatings analysed by scanning electron microscopy (SEM) shows that Cu particles are uniformly distributed. The hardness and wear resistance of Cu-P composite coatings are improved with the addition of SiC particles and increase with the increase of SiC content.

Item Type:Article
Uncontrolled Keywords:Electroless copper plating, Electroless deposited coating Hardness, Silicon carbide particles, Sodium hypophosphite, Wear resistance, Bath formulation, Coating compositions, Electroless, Electroless copper plating, Energy dispersive x-ray, Nickel sulfate, Operating parameters, pH value, SiC particles, Silicon carbide particles, Sodium citrate, Sodium hypophosphite, Concentration (process), Copper, Copper plating, Electroless plating, Hardness, pH effects, Phosphorus, Protective coatings, Scanning electron microscopy, Silicon carbide, Sodium, Wear resistance, Composite coatings, Concentration (process), Copper, Copper plating, Electroless plating, Hardness, pH effects, Phosphorus, Protective coatings, Scanning electron microscopy, Silicon carbide, Sodium, Wear resistance, Composite coatings
Subjects:?? TS200-770 ??
Divisions:SCHOOL > School of Engineering and Information Technology
ID Code:4888
Deposited By:IR Admin
Deposited On:18 Sep 2012 14:56
Last Modified:16 Feb 2015 11:35

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