Self-aligned double-gate (DG) nanoscale vertical MOSFET'S with reduced parasitic capacitance

Razali Ismail and Ismail Saad (2008) Self-aligned double-gate (DG) nanoscale vertical MOSFET'S with reduced parasitic capacitance. In: Smart Structures, Devices, and Systems IV, 10-12 December 2008, Melbourne, Australia.

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Abstract

Enhanced symmetrical self-aligned double-gate (DG) vertical nMOSFET with low parasitic capacitance is presented. The process utilizes the oblique rotating ion implantation (ORI) method combined with fillet local oxidation (FILOX) technology (FILOX + ORI). Self-aligned region forms a sharp vertical channel profile that increased the number of electrons in the channel. These have improved drive-on current and drain-induced-barrier-lowering (DIBL) effect with a reduced off-state leakage current tremendously. The gate-to-drain capacitance is significantly reduced while having a small difference of gate-to-source capacitance compared to FILOX device. The drain overlap capacitance is a factor of 0.2 lower and the source overlap capacitance is a factor of 1.5 lower than standard vertical MOSFETs. © 2008 SPIE.

Item Type: Conference or Workshop Item (UNSPECIFIED)
Keyword: Double gate, Nanoscale FET, Oblique rotating ion implantation, Self-aligned, Vertical MOSFETs
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK1-9971 Electrical engineering. Electronics. Nuclear engineering > TK7800-8360 Electronics
Department: SCHOOL > School of Engineering and Information Technology
Depositing User: ADMIN ADMIN
Date Deposited: 25 Mar 2011 12:23
Last Modified: 30 Dec 2014 15:00
URI: https://eprints.ums.edu.my/id/eprint/1613

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